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Filme xinst UV-1608 PO Fita para corte UV de substrato Fita para corte UV

•The PO/PET film was single coated with special adhesive which has high adhesion. With this tape, the wafer or glass would not
fall off or fly off during grinding and dicing.
• Not any residue on the surface of wafer or glass which is good for processing.
• High adhesion before UV.Once UV-light is exposed on, the adhesion is reduced and it can be removed easily

Wafer UV Dicing Tape is an ultra-strong adhesion UV tape, specially designed for deep-cutting process of LED modules, QFN chips,
camera modules, etc. It sustains a strong adhesion during dicing and can turn to very low adhesion after UV exposure, then easily
peeled off.

UV Dicing Tape Features:

•The PO/PET film was single coated with special adhesive which has high adhesion. With this tape, the wafer or glass would not
fall off or fly off during grinding and dicing.
• Not any residue on the surface of wafer or glass which is good for processing.
• High adhesion before UV.Once UV-light is exposed on, the adhesion is reduced and it can be removed easily

Nossas vantagens competitivas de fábrica:

Preços competitivos e controle de alta qualidade

Entrega rápida

Produtos ecológicos

Em uma variedade de design

Pedido pequeno aceitável

Aceito OEM

Tamanho do rolo: 3 ″ de papel ou núcleo de plástico; largura da fita: 2mm -1200mm; largura padrão: 1200 mm, comprimento padrão: 50 m

Tamanho do OEM: Comprimento, espessura ou combinações especiais podem ser fornecidos de acordo com a solicitação do cliente. Os produtos podem ser fornecidos em rolo,
fita, folhas ou formas de acordo com a solicitação do cliente. Apenas você fornece o desenho CAD, podemos cortar em qualquer tamanho para você.

Prazo Para obter o melhor desempenho, use este produto dentro de 12 meses a partir da data de entrega e armazene em condições normais de 60 ºC a 80 ºF (16 ºC a 27 ºC) e 40 a 60% UR na embalagem original.

 

High temperature 3m 471 tape pvc floor marking tape paint masking tape

If the xinst UV-1608 PO film Wafer UV Dicing Tape substrate UV Dicing Tape to your requirement, please be free to buy the quality products made in China with our professional manufacturers and suppliers in China. We’re equipped with a productive factory at your service.

UV Dicing Tape:

* This is for package saw like QFN or BGA.
* Mainly used for the package dicing of all kinds of IC wafers.
Nome do produto
xinst-UV1608 PO film Wafer UV Dicing Tape substrate UV Dicing Tape
Tipo adesivo
silicone
Cor
blue/transparent
Base de filme
PO film
Força de remoção
(antes de UV)
800gf / 25mm
Força de remoção
(após UV)
10gf / 25mm
Características
•The PO/PET film was single coated with special adhesive which has high adhesion. With this tape, the wafer or glass would not
fall off or fly off during grinding and dicing.
• Not any residue on the surface of wafer or glass which is good for processing.
• High adhesion before UV.Once UV-light is exposed on, the adhesion is reduced and it can be removed easily
Espessura
0.05mm 0.08mm 0.15mm 0.20mm

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