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Принцип применения силиконовой прокладки

xinst10 апреля 2020

Принцип применения силиконовой прокладки

Теплопроводящая силиконовая прокладка is a new product developed in the market of heat dissipation adhesive. It is mainly made of silicone to reduce the contact thermal resistance generated between the surface of the heat source and the contact surface of the heat sink. It is specially designed for the use of gaps to transfer heat to complete the heat transfer between the heat-generating parts and the heat-dissipating parts. It is an excellent thermally conductive filler material. The field of application of thermally conductive silicone pads is also very extensive. As long as it is a machine, it will generate heat when braking. This thermally conductive silicone pad is mostly developed for precision machinery. In the progress of science and technology, traditional heat dissipation adhesives can no longer meet the present Heat dissipation requirements for precision instruments.

Double-Sided Fiberglass Thermal Conductive Adhesive Tape

The main purpose of selecting thermally conductive silicone pads is to reduce the contact thermal resistance generated between the surface of the heat source and the contact surface of the heat sink. Thermally conductive silicone pads can also fill the gaps in the contact surface very well, pushing air out of the contact surface. Air is a bad conductor of heat, which will seriously hinder the transfer of heat between the contact surfaces; with the addition of thermally conductive silicone pads, the contact surfaces can be better and full contact, and truly face-to-face contact. The reaction at temperature can achieve the smallest possible temperature difference. The thermal conductivity of the thermally conductive silicone pad is relative. Although it has better thermal conductivity in flexible materials, it is generally in the range of 0.6-1.5W / (m · K). The performance may be higher, but none exceed 2W / (m · K).


In fact, the thermal conductive silicone pad is now widely used in the contact between the heating body (power tube, thyristor, electric pile, etc.) and heat dissipation facilities (heat sink, heat sink, shell, etc.) in various electronic products and electrical equipment Surface, play the role of heat transfer medium and moisture, dust, corrosion, shock and other performance. It is suitable for heat dissipation treatment of various microwave devices such as microwave communication, microwave transmission equipment, microwave special power supply, regulated power supply and so on.

Thermally conductive silicone pads developed on a traditional basis have great market prospects. The thermally conductive silicone pad is also a high-end thermally conductive compound, and it will not be solidified or conductive. It can avoid risks such as circuit short circuits; its high adhesion performance and super thermal conductivity are currently CPU, GPU and heat sink Excellent thermal conductivity solution when in contact.

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