Xinst 6011 Gjysëmpërçues Vafer Montues kuti shirit Shirit lirimi termik i njëanshëm

* Adhesive strength becomes almost “zero” by heating and REVALPHA can be removed without damaging substrates.
* Substrates can be processed by temporarily fixing a REVALPHA’s pressure sensitive adhesive face to the stage.
* Provides a high processing accuracy since substrates are kept in a fixed position.
*Three types (rolls, labelers and sheets) are available.
* Environmentally friendly since no cleaning is required for substrates

Dërgoni kërkesë

Xinst 6011 Gjysëmpërçues Vafer Montues kuti shirit Shirit lirimi termik i njëanshëm

Pyrolysis thinning film, called positioning slitting styrofoam in the industry, also known as hot peeling tape/cutting film/mlcc cutting film, etc., before being heated, it is pasted on the surface of the object, which can play a good role in the object. The function of protection and shielding can be easily debonded after the thermal process, so that the processed parts can be easily/easy peeled off without leaving residual glue, which is conducive to automation, saves manpower/material resources, and improves efficiency.

Thermal Release Tape Applications:

Used in delicate and fragile wafer processing; positioning and cutting in the process of MLCC chip capacitors and chip inductors; semiconductor wafer surface processing; electronic and optoelectronic industrial components manufacturing and processing engineering; LCD and TP touch panel glass thinning, grinding and polishing; LED cutting, grinding and polishing; sapphire substrate thinning and polishing process; copper substrate graphene (Graphene) transfer and carbon nanotube transfer applications, which can replace UV blue film.

Size: 150*150 160*160 180*180 200*200mm, etc., special specifications can be cut according to customer needs.

Viscosity: low viscosity 200G; medium viscosity 400G; high viscosity 700G; special viscosity can be customized according to customer needs.

Stripping temperature: 90-100 degrees, the slitting temperature does not exceed 70 degrees; 120-130 degrees, the slitting temperature does not exceed 90 degrees; 140-150 degrees, the slitting temperature does not exceed 120 degrees. Special needs customer demand production.

Foaming peeling time: 10 seconds-3 minutes.

Special reminder; the oven temperature must reach the set temperature before the product can be put in for foaming, so that the effect can be achieved.

Projektimet e prerjes mund të përfshijnë vrima, forma, vija të mëdha (për heqje të lehtë) dhe produkte plotësues gjithashtu mund të përfshihen.
Shiritat e prerjes ju lejojnë të kurseni një kohë të konsiderueshme kur vendosni shiritin ngjitës dhe të kurseni para për prerje përmes prerjes.

Avantazhet tona konkurruese të fabrikës:

Çmime konkurruese dhe Kontrolli i Cilësisë së Lartë Dorëzimi i Shpejtë Produkte miqësore për Tokën në një larmi të Dizajnit OEM i pranueshëm i porosisë së vogël

Madhësia e rrotullës: 3 ″ letër ose bërthamë plastike; gjerësia e shiritit: 2 mm -1200 mm; gjerësia standarde: 1200 mm, gjatësia standarde: 50 milion

Madhësia OEM : Gjatësia, trashësia ose kombinimet speciale mund të sigurohen sipas kërkesës së klientit. Produktet mund të furnizohen në listë, shirit, fletë ose forma për kërkesën e klientit. Vetëm ju siguroni vizatimin CAD, ne mund të prerë çdo madhësi për ju.

Afati i ruajtjes: Për të arritur performancën më të mirë, përdorni këtë produkt brenda 12 muajve nga data e dorëzimit dhe ruani në kushte normale prej 60 ºC deri 80 ºF (16 ºC deri 27ºC) dhe 40 deri 60% RH në kartonin origjinal

Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape

If the Xinst 6011 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape to your requirement, please be free to buy the quality products made in China with our professional manufacturers and suppliers in China. We’re equipped with a productive factory at your service.

Applications:

Size: 150*150 160*160 180*180 200*200mm, etc., special specifications can be cut according to customer needs. Viscosity: low viscosity 200G; medium viscosity 400G; high viscosity 700G; special viscosity can be customized according to customer needs. Stripping temperature: 90-100 degrees, the slitting temperature does not exceed 70 degrees; 120-130 degrees, the slitting temperature does not exceed 90 degrees; 140-150 degrees, the slitting temperature does not exceed 120 degrees. Special needs customer demand production. Foaming peeling time: 10 seconds-3 minutes. Special reminder; the oven temperature must reach the set temperature before the product can be put in for foaming, so that the effect can be achieved.Die cutting designs can includes holes, shapes, oversized lines (for easy removal) and complimentary products can also be incorporated.
Shiritat e prerjes ju lejojnë të kurseni një kohë të konsiderueshme kur vendosni shiritin ngjitës dhe të kurseni para për prerje përmes prerjes.

Product Name	Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape
Adhesive Type	Foaming adhesive
Color	white/blue/yellow
Temperature Resistance	-20°C -130°C
Before foaming	4.0N/20mm
After foaming	0.02N/20mm
Karakteristikat	* Adhesive strength becomes almost “zero” by heating and REVALPHA can be removed without damaging substrates. * Substrates can be processed by temporarily fixing a REVALPHA’s pressure sensitive adhesive face to the stage. * Provides a high processing accuracy since substrates are kept in a fixed position. Three types (rolls, labelers and sheets) are available. Environmentally friendly since no cleaning is required for substrates.
Thickness	0.15mm

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