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فيلم لاصق تذوب ساخن لفيلم PI

اكسينست11 أغسطس 2020

نظرًا لكونه مادة قطع قوالب لأغشية البوليمر تم تطويرها في السنوات العشر الماضية ، فقد أثبت فيلم PI بسرعة مكانته في مجال مواد الأفلام العضوية وقد تم استخدامه على نطاق واسع نظرًا لأدائه الشامل الممتاز. إذن ما مدى معرفتك بالفيلم اللاصق بالذوبان الساخن لفيلم PI ؟

500F polyester polyimide film Hot melt PI film

PI film is also called polyimide film, and its main component is polyimide, which is one of the films with high temperature resistance and good stability. PI film is a kind of film widely used in the field of electronic products. The color is usually brown and black. The hot melt adhesive film types used in film bonding are PA and PES hot melt adhesive films.

The main component of PA hot melt adhesive film is copolyamide, which has certain commonalities with PI film in composition. Therefore, when using PA hot melt adhesive film to bond PI film, its viscosity It is very good, and the melting point of PA hot melt adhesive film is relatively high, generally around 115℃-130℃, which belongs to high temperature hot melt adhesive film. The recommended use temperature is 140-160℃, and it still has good adhesion at high temperature Performance and stability, which are also in line with the characteristics of PI membrane applications. PA hot melt adhesive film is transparent and non-elastic,

The main component of PES hot melt adhesive film is copolyester, which is also good for PI film. The biggest feature of PES hot melt adhesive film is that it has excellent washing resistance. It can maintain good adhesion even under water conditions, and the cost will be relatively lower, but the viscosity is better than PA hot melt adhesive The membrane is slightly worse.

The melting point of PES hot melt adhesive film is about 105°C-115°C, which is a medium-temperature hot melt adhesive film. The recommended use temperature is 130-160°C, the temperature resistance does not exceed 80°C , and the color is white and matte, without elasticity.

Adhesive processing of adhesive film for PI film

Many friends are not very clear about how the hot melt adhesive film is backed to the PI film, so let's share with you the method of how to back the hot melt adhesive film to the PI film (polyimide film).

First of all, the use of hot melt adhesive film requires the help of pressing tools, such as industrial irons or laminating machines. Take an industrial iron as an example. First align the hot melt adhesive film with the backing paper with the inside of the PI film, with the backing paper facing out, and then use the industrial iron to heat and iron on the backing paper to make heat conduction The adhesive layer in the middle makes it melt and sticky, and sticks the PI film. Because the other side is protected by the backing paper, the adhesive film will not directly stick to the iron. Wait for it to cool down and then peel off the backing. The protective paper completes the adhesive work of the product.

إذا كنت ترغب في إعادة لصق الفيلم اللاصق بالذوبان الساخن بدون دعم الورق بغشاء PI ، فأنت بحاجة إلى استخدام آلة مركبة مسطحة أو أسطوانية للتشغيل.

يحتاج فيلم PI المدعوم بالمادة اللاصقة أيضًا إلى استخدام أدوات الضغط في الاستخدام اللاحق. على سبيل المثال ، استخدم مكواة أو آلة ضغط للضغط على جانب واحد من فيلم PI ، ويمكن لصق فيلم PI مع المادة اللاصقة بمواد أخرى. ، لاستكمال ترابط المنتج النهائي.

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