Wafer UV Dicing Tape Specifications:

 Wafer UV Dicing Tape is an ultra-strong adhesion UV tape, specially designed for deep-cutting process of LED modules, QFN chips, camera modules, etc. It sustains a strong adhesion during dicing and can turn to very low adhesion after UV exposure, then easily peeled off.

UV Dicing Tape Features:
•The PO/PET film was single coated with special adhesive which has high adhesion. With this tape, the wafer or glass would not fall off or fly off during grinding and dicing.
• Not any residue on the surface of wafer or glass which is good for processing.
• High adhesion before UV.Once UV-light is exposed on, the adhesion is reduced and it can be removed easily

Recommended Applications

* This is for package saw like QFN or BGA.

* Mainly used for the package dicing of all kinds of IC wafers.

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Pequeña orden aceptable

OEM aceptado

Tamaño del rollo:Núcleo de papel o plástico de 3″; ancho de cinta: 2 mm -1200 mm; ancho estándar: 1200 mm, longitud estándar: 50 m

OEM Size:Special length, thickness or combinations can be supplied per customer’s request.Products can be supplied in roll,tape,sheets or shapes per customer’s request.Only you provide the CAD drawing,we can die cut any size for you.

Duración: To obtain best performance, use this product within 12 months from date of delivery and store under normal conditions of 60 ºC to 80ºF (16 ºC to 27ºC) and 40 to 60% R.H. in the original carton