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Zinnbeschichtetes kupferleitendes Folienband für EMI-Abschirmung

Herkunftsort: Guangdong, China
Markenname: Xinst
: 6970CU
Material: Zinn + Cu
Merkmal
Verwendung: Maskierung
Klebstoff: Acryl
Seite: Doppelseitiger
Klebstofftyp: Druckempfindlich
Designdruck: Kein Druck
Farbe: Kupfer
Kupferdicke (mm): 0,08
Anwendung: Reparatur für Abschirmungssignalkabel oder FFC

Produktbeschreibung aus verzinntem kupferleitendem Folienband

Tin-plated-copper-conductive-foil-tape consists of an embossed deadsoft tin-plated copper foil backing and an aggressive pressure-sensitve acrylic adhesive. The edgs of the embossed pattern pressed into the foil cut through the adhesive layer to establish reliable metal-to-metal contact between the backing and the application substrate.

 Features:

• Good electrical conductivity from the base material through the surface of viscose to foil substrate.

• With good shielding effect.

 

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OEM-akzeptiert.

Roll Size: 3″ paper or plastic core;tape width: 2mm -1200mm; standard width: 1200mm, standard length: 50M.

OEM Size: Special length, thickness or combinations can be supplied per customer’s request. Products can be supplied in roll, tape, sheets or shapes per customer’s request. Only you provide the CAD drawing, we can die cut any size for you.

Shelf Life: To obtain best performance, use this product within 12 months from date of delivery and store under normal conditions of 60 ºC to 80ºF (16 ºC to 27ºC) and 40 to 60% R.H. in the original carton.

 

If the pet insulation transformer mylar tape caters to your requirement, please be free to buy the quality products made in China with our professional manufacturers and suppliers in China. We’re equipped with a productive factory at your service.

Double Tin Plated Copper Conductive Foil Tape Applications:

• Used for high-end electronic equipment, components of the grounding and EMI shielding, the tin on the plating layer has good weld-ability, and high oxidation and corrosion resistance.

Double Tin Plated Copper Conductive Foil Tape  Specifications:

Part No. Color Backing  Total Thickness (um) The melting point temperature of tin plating layer   Adhesion (g/25mm) 
  6970CU Sliver Tin+Cu 70±5 >232℃  800±100

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