Xinst6011半導体ウェーハマウンターダイシングテープ片面サーマルリリーステープ

* Adhesive strength becomes almost “zero” by heating and REVALPHA can be removed without damaging substrates.
* Substrates can be processed by temporarily fixing a REVALPHA’s pressure sensitive adhesive face to the stage.
* Provides a high processing accuracy since substrates are kept in a fixed position.
*Three types (rolls, labelers and sheets) are available.
* Environmentally friendly since no cleaning is required for substrates

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Xinst6011半導体ウェーハマウンターダイシングテープ片面サーマルリリーステープ

Pyrolysis thinning film, called positioning slitting styrofoam in the industry, also known as hot peeling tape/cutting film/mlcc cutting film, etc., before being heated, it is pasted on the surface of the object, which can play a good role in the object. The function of protection and shielding can be easily debonded after the thermal process, so that the processed parts can be easily/easy peeled off without leaving residual glue, which is conducive to automation, saves manpower/material resources, and improves efficiency.

Thermal Release Tape Applications:

Used in delicate and fragile wafer processing; positioning and cutting in the process of MLCC chip capacitors and chip inductors; semiconductor wafer surface processing; electronic and optoelectronic industrial components manufacturing and processing engineering; LCD and TP touch panel glass thinning, grinding and polishing; LED cutting, grinding and polishing; sapphire substrate thinning and polishing process; copper substrate graphene (Graphene) transfer and carbon nanotube transfer applications, which can replace UV blue film.

Size: 150*150 160*160 180*180 200*200mm, etc., special specifications can be cut according to customer needs.

Viscosity: low viscosity 200G; medium viscosity 400G; high viscosity 700G; special viscosity can be customized according to customer needs.

Stripping temperature: 90-100 degrees, the slitting temperature does not exceed 70 degrees; 120-130 degrees, the slitting temperature does not exceed 90 degrees; 140-150 degrees, the slitting temperature does not exceed 120 degrees. Special needs customer demand production.

Foaming peeling time: 10 seconds-3 minutes.

Special reminder; the oven temperature must reach the set temperature before the product can be put in for foaming, so that the effect can be achieved.

型抜き設計には、穴、形状、特大の線（簡単に取り外せるようにするため）を含めることができ、無料の製品を組み込むこともできます。
型抜きテープを使用すると、粘着テープを貼る時間を大幅に節約し、スリットによる切断にかかる費用を節約できます。

私たちの工場の競争上の優位性：

競争力のある価格と高品質管理迅速な配達さまざまなデザインの地球に優しい製品少量注文受け入れ可能なOEM受け入れ

ロールサイズ：3インチの紙またはプラスチックコア;テープ幅：2mm -1200mm; 標準幅：1200mm、標準長さ：50M

OEMサイズ：お客様のご要望に応じて、特別な長さ、厚さ、または組み合わせを提供できます。製品は、お客様のご要望に応じて、ロール、テープ、シート、または形状で提供できます。CAD図面を提供する場合にのみ、任意のサイズのダイカットを行うことができます。

寿命：最高の性能を得るには、納品日から12か月以内にこの製品を使用し、元のカートンで60ºC〜80ºF（16ºC〜27ºC）および40〜60％RHの通常の条件下で保管してください。

Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape

Xinst 6011セミコンダクターウェーハマウンターダイシングテープ片面サーマルリリーステープが必要な場合は、中国の専門メーカーおよびサプライヤーと一緒に中国製の高品質製品を自由に購入してください。私たちはあなたのサービスで生産的な工場を備えています。

アプリケーション：

Size: 150*150 160*160 180*180 200*200mm, etc., special specifications can be cut according to customer needs. Viscosity: low viscosity 200G; medium viscosity 400G; high viscosity 700G; special viscosity can be customized according to customer needs. Stripping temperature: 90-100 degrees, the slitting temperature does not exceed 70 degrees; 120-130 degrees, the slitting temperature does not exceed 90 degrees; 140-150 degrees, the slitting temperature does not exceed 120 degrees. Special needs customer demand production. Foaming peeling time: 10 seconds-3 minutes. Special reminder; the oven temperature must reach the set temperature before the product can be put in for foaming, so that the effect can be achieved.Die cutting designs can includes holes, shapes, oversized lines (for easy removal) and complimentary products can also be incorporated.
型抜きテープを使用すると、粘着テープを貼る時間を大幅に節約し、スリットによる切断にかかる費用を節約できます。

製品名	Xinst 0611 Semiconductor Wafer Mounter dicing Tape single sided thermal release tape
接着剤タイプ	Foaming adhesive
色	white/blue/yellow
温度耐性	-20°C -130°C
Before foaming	4.0N/20mm
After foaming	0.02N/20mm
特長	* Adhesive strength becomes almost “zero” by heating and REVALPHA can be removed without damaging substrates. * Substrates can be processed by temporarily fixing a REVALPHA’s pressure sensitive adhesive face to the stage. * Provides a high processing accuracy since substrates are kept in a fixed position. Three types (rolls, labelers and sheets) are available. Environmentally friendly since no cleaning is required for substrates.
厚さ	0.15mm

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