+86 137 6041 5417 sales@szxinst.com
search button

NITTO REVALPHA No.3195 Thermal Release Tape For Hard Substrate

* Adhesive strength becomes almost “zero” by heating and REVALPHA can be removed without damaging substrates.

* Substrates can be processed by temporarily fixing a REVALPHA’s pressure sensitive adhesive face to the stage.
* Provides a high processing accuracy since substrates are kept in a fixed position.
*Three types (rolls, labelers and sheets) are available.
* Environmentally friendly since no cleaning is required for substrates.

NITTO3195 REVALPHA No.3195 Thermal Release Tape For Hard Substrate

The nitto3195 thermal release tape "REVALPHA" is a unique adhesive tape that adheres tightly at room temperature and can easily be peeled off
just by heating. The tape contributes significantly to automation/laborsaving of various electronic component manufacturing
processes.

NITTO REVALPHA No.3195 Thermal Release Tape For Hard Substrate Applications:

* Temporary fixing during dicing electronic components.

* Temporary fixing to prevent misalignment of the substrates.

* For chip transfer.

Die cutting designs can includes holes, shapes, oversized lines (for easy removal) and complimentary products can also be incorporated.
Die cutting tapes enable you to save a significant amount of time when applying the adhesive tape and to save money for cuts through slitting.

Our Factory Competitive Advantages:

Well Competitive Prices and High Quality Control Prompt Delivery Earth-friendly Products In a Variety of Design Small Order Acceptable OEM Accepted

Roll Size: 3″ paper or plastic core;tape width: 2mm -1200mm; standard width: 1200mm,standard length:50M

OEM Size:Special length, thickness or combinations can be supplied per customer’s request.Products can be supplied in roll,tape,sheets or shapes per customer’s request.Only you provide the CAD drawing,we can die cut any size for you.

Shelf Life: To obtain best performance, use this product within 12 months from date of delivery and store under normal conditions of 60 ºC to 80ºF (16 ºC to 27ºC) and 40 to 60% R.H. in the original carton

nitto3195 Thermal Release Tape

If the 3M 9890 heat transfer feature double sided thermal conductive tape for LED CPU to your requirement, please be free to buy the quality products made in China with our professional manufacturers and suppliers in China. We’re equipped with a productive factory at your service.

NITTO REVALPHA No.3195 Thermal Release Tape For Hard Substrate Applications:

* Temporary fixing during dicing electronic components.

* Temporary fixing to prevent misalignment of the substrates.

* For chip transfer.

Die cutting designs can includes holes, shapes, oversized lines (for easy removal) and complimentary products can also be incorporated.
Die cutting tapes enable you to save a significant amount of time when applying the adhesive tape and to save money for cuts through slitting.

Product Name
NITTO REVALPHA No.3195 Thermal Release Tape For Hard Substrate
Adhesive Type
Foaming adhesive
Color
white/blue/yellow
Temperature Resistance
-20°C -100°C
Before foaming
4.0N/20mm
After foaming
0.02N/20mm
Features

* Adhesive strength becomes almost “zero” by heating and REVALPHA can be removed without damaging substrates.

* Substrates can be processed by temporarily fixing a REVALPHA’s pressure sensitive adhesive face to the stage.
* Provides a high processing accuracy since substrates are kept in a fixed position.
*Three types (rolls, labelers and sheets) are available.
* Environmentally friendly since no cleaning is required for substrates.
Thickness
0.16mm

SEND EMAIL TO US

    email Contact
    go top