UV Curable Dicing Tape For Wafer Cutting
Min Order Quantity: 1000 Square Meters
Supply Ability: 15000 Square Meters
Port: Shenzhen, China
Payment Terms: T/T, L/C, Paypal, Western Union
Delivery Time: About 10-15 days
It Is As Polyolefin Film As Backing, Coated With UV Adhesive, Then Coated With PET Release Liner.
Export standard packing for UV Curable Dicing Tape For Wafer Cutting. (If customers have special requirements, we also can make accordingly.)
Our Factory Competitive Advantages:
- Well Competitive Prices and High Quality Control
- Prompt Delivery
- Earth-friendly Products
- In a Variety of Design
- Small Order Acceptable
- OEM Accepted
Note: All data contained in this document base on china standard test method, they are average values, they should not be used for a specific purpose. All statements, technical information, and recommendations contained are base upon tests that we believe are reliable, but we strongly recommend clients should do their own tests and decide whether the product is fit for a particular purpose or the method of application.
These product properties are suggestive and all products can be customized or converted to fit specific application requirements. Please contact us to discuss your unique application needs.
- Suitable for made from silicon wafer cutting process protection.
- Suitable for ITO glass, COVER LENS glass COVER chemical intensification of the acid etching process.
- Other need stick tightly high protection, later need easy tear off process protection.
|Total Thickness (μm)||170||/|
|Base Film (μm)||Polyolefin / 150||Material / Thickness|
|Adhesive layer (μm)||UV Acrylic/20||Material / Thickness|
|Adhesion (g/25mm)||Before UV||2000±100||Conforms to JIS Z 0237(1)|
|PET Release Line (μm)||36||Thickness|
|JIS Z0237: Peeling speed=300mm/min, Peeling angle=180 deg.|
|UV Irradiation Conductions:||UV ray intensity: 230mW/cm²|
|UV ray dosage: 190mJ/cm²|
|Wave length of ultraviolet should be around 365nm. If light source is led, the recommended lighting time is around 20 second.|